The DSDC has published the research article "Advanced Characterization of a Hybrid Shielding Solution for Reducing Electromagnetic Interferences at Board Level" in the prestigious MDPI Electronics journal.

The publication is the result of the work carried out in the Würth-UV EMC Chair of Electromagnetic Compatibility, and has been published in the special issue of the journal, dedicated exclusively to "Advances in Electromagnetic Interference and Protection".

The contribution focuses on studying and characterizing a board level shielding (BLS) solution based on the combination of a noise suppression sheet (NSS) with an aluminum layer to reduce intra-system EMI coupling. This hybrid solution has the advantage of providing a shielding option that does not require any electronic redesign. It does not need space or grounding as it can be connected to the EMI source. The solution is expected to provide higher attenuation levels than using an NSS alone by combining the absorbing properties of the magnetic material and the loss mechanism of the metal. To verify the effectiveness of the hybrid solution proposed by BLS, the near-field magnetic emissions from an EMI source are analyzed in this study. Experimental measurements and simulated results demonstrate a significant increase (51.6 dB at 1 GHz) in shielding effectiveness (SE) provided by the proposed solution compared to a conventional NSS.

The MDPI Electronics journal is open access, so the full article can be accessed for free at the following link.

https://www.mdpi.com/2079-9292/13/3/598